1L.F.Cecil,T.C.Ward.The oligomeric silsesquioxanes (HSiO3/2)n [J].Journal of the american chemical society, 197(:9.
2丁隶均.纳米材料[M].北京:机械工业出版社,2004:8.
3J.jyongsik, B.Joonwon, et al.Phase-Separation Prevention and Performance Improvement of Poly (vinyl acetate)/TEOS Hybrid Using Modified Sol-Gel Process [J].Journal of Applied Polymer Science, 2001:8.
1Sprung M M, Guenther F O. The partial hydrolysis of methyltriethoxysilane. J. Am. Chem. Soc. , 1955; 77:3 990～3 996
2Sprung M M, Guenther F O. The partial hydrolysis of ethyltriethoxysilane. J. Am. Chem. Soc., 1955; 77:3996～4002.
3Brown J F Jr. The polycondensation of phenylsilanetriol. J. Am. Chem. Soc. ,1965;87:4 317～4324.
4Huanga J C, Hea C B, Yang Xiao et al. Polyimide/POSS nanocomposites: interfacial interaction, thermal properties and mechanical properties. Polymer, 2003 ;44:4 491 ～4 499.
6Schwab J J, Lichtenhan J D, Chaffee K P et al. Investigations into structure/property relationships for polyhedral oligomeric silsesquioxane (POSS) based methacrylate polymers.Polymer Priprints, Division of Polymer Chemistry, 1997 ;38 ( 1 ):518 ～519.
7Lichtenhan J D, Vu N O,CarterJ A. Silsesquioxanesiloxane copolymers from polyhedral silsesquioxane. Macromolecules, 1993;26(8) :2 141 ～2 142.
8Sellinger A,Laine R M. Silsesquioxanes as synthetic platforms. Thermally curable and photocurable inorganic/organic hybrids. Macromolecules, 1996; 29(6) :2 327 ～2 330.
9Leu C M,Reddy G M,Wei K H et al. Synthesis and dielectric properties of polyimide-chain-end tethered polyhedral oligomeric silsesquioxane nanocomposites. Chem. Mater.,2003; 15: 2 261 ～ 2 265.
10Leu C M, Chang Y T, Wei K H et al. Synthesis and dielectric properties of polyimide-tethered polyhedral oligomeric silsesquioxane (POSS) nanocomposites via POSS-diamine.Macromolecules, 2003; 36:9 122 ～9 127.
