TO-220FS封装工艺改进研究

Study of Assembly Technology for TO-220FS

文章通过分析对比TO-220FS封装产品内部与传统全包封产品内部结构的差异性,来展现产品的生产、工艺流程中的各技术难点。然后通过对各技术难点进行成因分析并采取相对应的解决方案,使技术难关得到顺利攻克。该过程所攻克的技术要点包括工艺条件、工艺技术、设备改造,解决了粘晶过程的锡层控制、焊线过程消除应力作用、塑封针孔、去料道、剪切拉筋、绝缘测试等问题,顺利地实现了批量生产,装配后产品技术指示能满足市场要求,产品质量稳定。

This paper shows the difficulties of production, process the various technical by analyzing and contrasting the difference of the internal structure between the TO-220FS package and general product. And then by analyzing the causes of technical difficulties and taking the corresponding solutions, the technical difficulties are overcome smoothly. The process including process conditions, technology, equipment modification, solve the problem of solder thickness control, eliminate stress in wire process, plastic pinhole, drunker, tendon pull in trimming process, isolation testing etc, the mass production successfully achieved.