高标准无铅PCB耐热性及其影响因素研究

Research on thermal character & influencing factors for high standard lead-free PCB

针对要求通讯类PCB可承受峰温超过260℃、且无铅回流焊次数达到5次的高标准要求,本项目从PCB的材料选择、工程设计、制造工艺方面出发,建立了PCB耐热性的评测模型,评测了主要的高性能无铅板材、半固化片、PCB设计和PCB制造过程中的层压、钻孔、去钻污等关键工艺过程进行了研究,提升了PCB的耐热性,并建立起高标准无铅PCB的设计和选材规则、制造工艺和品质控制规范。

By the high standard of lead-free, the peak temperature of reflow is above 260℃, and the times of cycling are up to 5. This project built the model of evaluationg the thermal resistance of PCB and the leading high-performance lead-free CCL and prepreg, PCB design and the PCB manufacturing process etc. Finally, the heat resistance of the PCB was improved and met the high standard lead-free requirements.