摘要
文章主要针对PCB在制作过程中吸潮以及成品板吸潮导致的爆板进行分析探讨。文中展示了板边、板内以及半堵孔等不同原因造成的爆板类型,通过Tg测试、湿气含量测试等不同方法验证PCB是否吸潮,并根据不同的成因制定改善措施。
This article analyzed causes of moisture absorption in process and finished boards which resuhed in delamination. The article demonstrated different types of delamination, such as located at the fringe and center of the board, semi phig-hole delamination and so on. It also provided the improving measure according to the dilTerent causes which is tested through TG, moisture content and other test methods.
出处
《印制电路信息》
2013年第11期34-37,41,共5页
Printed Circuit Information
关键词
吸潮
爆板
湿气含量
Moisture Absorption
Delamination
Moisture Content
