摘要
PCB板厚控制是一个系统且涉及面广的工程,本文运用统计分析以及理论计算相结合的方法,从PCB板厚工程设计、层压板厚控制以及其它工序对板厚的影响等方面入手,系统阐述了PCB板厚的一些控制要点,为PCB板厚控制提供理论依据。
The work of PCB thickness control is a systematic and covers a wide range project. In this paper, the influences of PCB engineering design, lamination as well as other processes related on the PCB thickness were investigated by using statistical analysis and calculation, and some key points were concluded systematically, which provided a theoretical basis of PCB thickness control.
出处
《印制电路信息》
2013年第11期42-46,共5页
Printed Circuit Information
关键词
板厚控制
工程设计
层压
PCB Thickness Control
Engineering Design
Lamination
