电子回旋共振波射频溅射系统设计

Design of the electron cyclotron wave resonance RF sputtering system

电子回旋共振波(ECWR)技术于20世纪70年代提出,是利用电磁波与电学各向异性材料(如带有外加静磁场的低压等离子体)的相互作用来产生等离子体的。ECWR技术有产生高密度等离子体、离子能量可控制在很窄的范围内、离子能量和离子流量可独立控制等优点,可有效控制薄膜的生长过程。本文以ECWR技术为背景,介绍了一种电子回旋共振波射频溅射镀膜系统的设计。

Electron cyclotron wave resonance（ECWR） technique was proposed in the 1970s. Plasma generation by ECWR makes use of a special case for the interaction of an electromagnetic wave with an electrically anisotropic medium like low pressure plasma with a small superimposed static magnetic field, tks a new technology, it has many advantages. First, it can provide high density plasma. Second, the range of the ion energy is very narrow. Third, the ion energy and the ion density can be controlled separately. It can control the film growth process effectively. This paper describes the design of a RF sputtering system, which is based on the ECWR technology.