微通道散热器新型通道设计及性能分析

Analysis and design of microchannel structure on microchannel heat sink

微电子设备的发热问题严重影响着其可靠性,散热器的热设计已成为微电子设备结构设计中不可忽略的一个重要环节。微通道散热是近年来发展起来的一种新型散热措施。设计了多种新型的微通道散热器结构,并利用数值方法研究了新型微通道结构散热性能及微通道内流体的流场分布情况。研究结果表明,新型微通道散热器增大了换热比表面积,具有较好的散热效率。菱形肋微通道(导流角度120°)的散热效率改善的尤为明显。各新型微通道靠近壁面的死区较少,流体与通道的接触面积也更多,因而换热效果较好。尤其是菱形肋微通道(导流角度30°)内的流场分布更为均匀。

Heating problem of microelectronic device has an serious affect on its reliability. The thermal design of microchan- nel heat sink is an important part of the microelectronic device design. Heat dissipation by microchannel heat sink provides a new method for thermal management. Several kinds of new microchannel structures were introduced in this paper. Their properties of thermal and fluid flow were researched with the aid of numerical simulation. The results show that these new microchannel struc- tures have larger heat transfer surface and higher thermal efficiency. Especially, the diamond - rib microchannel structure（ diver- sion angle = 120°） has the highest thermal efficiency. The dead zone of fluid flow close to the wall of these new mircochannel structures is decreased. Especially, the diamond -rib microchannel structure（ diversion angle = 30°） has the most uniform flow distribution.