摘要
随着电子芯片发展的高度集成化,散热问题日益凸显,芯片微通道散热器以其优越的散热性能而被广泛应用。文章从影响微通道散热器性能的主要因素,即流动工质、微通道结构、制作材料三个方面对最新研究成果进行综述。通过对各种研究结果的分析,发现一些常规槽道中被忽略的因素,如槽道宽高比、进出口效应、表面粗糙度、槽道孔隙率等会对芯片微通道散热器的换热性能产生较大的影响。同时指出了目前研究工作中存在的不足,展望了芯片冷却用微通道散热器的发展前景,并提出了新的研究思路。
With the development of high integration of electronic chips, the problem of chip heat dissipation becomes increasingly prominent. The microchannel heat sink is widely used owing to its superior heat dissipation performance. In this paper, the latest research results are introduced from the three aspects of flow medium, production material and microchannel configuration, which are the main factors affecting the performance of heat exchanger. Analysis results show that some factors, including width-height ratio of slot, entrance and export effect, surface roughness, channel porosity, etc, which are neglectecd in conventional studies, also have a great effect on the performance of chip microchannel heat exchanger. And also the shortages in present researches are pointed out, and the future developments are prospected.
出处
《半导体光电》
CAS
CSCD
北大核心
2013年第5期725-731,883,共8页
Semiconductor Optoelectronics
关键词
芯片
微通道
传热
材料
结构
chip
microchannel
heat transfer
material
configuration
