摘要
本文较全面地介绍了近年来发展起来的叠层型片式磁珠的基本特性、制造工艺技术、尺寸系列和性能类别。最后列举了叠层型片式磁珠在计算机、移动通信等电子产品中的应用实例。
This paper more overall introduces the basic features, processing technologies, dimentional serieses and property types of currently developed multilayer chip beads, and finally gives applicable examples of multilayer chip beads for computers, electronic products and mobile telecommunication.
出处
《电子元器件应用》
2000年第12期7-12,36,共7页
Electronic Component & Device Applications
