基于分子动力学的纳米铜-镍扩散焊接模拟研究

Molecular dynamics simulation of diffusion bonding of nano-Cu-Ni interface

采用分子动力学方法研究了纳米铜-镍异质金属之间的高温扩散过程,并对退火后得到的扩散模型进行拉伸模拟。结果表明:在相同升温、加压和退火条件下,保温时间越长,扩散模型的过渡层厚度越大,拉伸强度越小;当保温时间为600 ps,扩散模型的拉伸强度为11.62 GPa,达到理想接触铜-镍模型拉伸强度的76%。

The high-temperature diffusion process of nano-Cu-Ni interface was studied using molecular dynamics simulations,and diffusion-bonded Cu-Ni model was subjected to tensile loading. The results indicate that the transition layer thickness of the diffusion model increases and its tensile strength decreases with increasing the holding time under the same conditions of heating,pressure and annealing. When the holding time is up to 600 ps,tensile strength of the diffusion model is 11.62 GPa, reaching 76%of the ideal Cu-Ni contact strength.