摘要
对Cu-2.1Ni-0.5Si合金在时效过程中的电导率、布氏硬度及抗拉强度的变化进行了研究,采用扫描电镜观察时效后合金的显微组织,分析第二相的分布及形成机理,以及时效组织的强化机制。结果表明Cu-2.1Ni-0.5Si合金在900℃固溶1 h后再500℃时效1h可得到最佳性能,该合金时效初期即1～2h时组织是以调幅分解和有序化强化交替进行,2h以后主要以Ni2Si相的析出为主要强化机制。
Changes of conductivity, Brinell hardness and tensile strength for Cu-2.1Ni-0.5Si alloy in the process of aging were analyzed. The microstructure of alloy after aging was observed by using SEM, and the second phase distribution and formation mechanism of alloy were also analyzed. The results show that： the Cu-2.1Ni-0.5Si alloy soluted at 900 ℃ for 1 h and then aged at 500 ℃ for 1 h can get the best properties. The optimum performance of the alloy in early aging between 1-2h organizations is the alternating behavior of spinodal decomposition and ordering enhanced. The main strengthening mechanism after 2h is the the precipitation of Ni2Si phase.
出处
《热加工工艺》
CSCD
北大核心
2013年第22期179-181,共3页
Hot Working Technology
