期刊文献+

高导热低黏度环氧树脂灌封胶 被引量:7

Epoxy Potting Adhesive with High Thermal Conductivity and Low Viscosity
原文传递
导出
摘要 以E-51型环氧树脂为基体,Al2O3为导热填料,CYH-277为稀释剂制备高导热低黏度环氧树脂灌封胶。优化了硅烷偶联剂KH-560、稀释剂CYH-277的用量;分别采用NDJ-7型旋转式黏度计和Hot Disk型热常数分析仪测试其黏度和导热系数。结果表明:硅烷偶联剂KH-560用量为1.25%(wt)时效果最优;随CYH-277用量的增加灌封胶黏度、耐热性能均逐渐下降,最佳用量为25%(wt);随Al2O3用量增加,灌封胶的黏度、导热系数均增大;用量相同时,填充20μm Al2O3的树脂体系相比于填充6μm Al2O3树脂体系黏度小、导热系数大,复配两种粒径Al2O3对应树脂体系的导热性最好;复配Al2O3用量为86%(wt)时,导热系数达到2.23W/(m·K),此时灌封胶的黏度为30100mPa·s,仍保持较好的加工流动性。 An epoxy potting adhesive with high thermal conductivity and low viscosity was prepared with using E-51 epoxy resin as a matrix,Al2O3 as a thermally conductive filler,and CYH-277 as a diluent.The amount of coupling agent and diluent were optimized.The viscosity and thermal conductivities of the epoxy potting adhesive were investigated by NDJ-7 rotation viscometer and Hot Disk thermal constant analyzer.The results showed that the best dosage of KH-560 was 1.25%(wt).The viscosity and heat resistance both gradually declined with the increasing dosage of CYH-277 and the best dosage was 25%(wt).The viscosity and thermal conductivity both rose with the increasing content of Al2O3.when the filler content was same,the 20μμm Al2O3 was beneficial to a higher thermal conductivity and a lower viscosity than the 6μm Al2O3. Compared with single Al2O3 filled composite,it was found that the hybrid Al2O3 filled composite had higher thermal conductivity.When the filling fraction of hybrid Al2O3 was 86%(wt),the thermal conductivity reached 2.23W/(m·K) and the viscosity was 30100mPa·s,which showed high thermal conductivity and good flow properties.
出处 《化学与粘合》 CAS 2013年第6期16-18,35,共4页 Chemistry and Adhesion
关键词 环氧树脂 AL2O3 导热系数 灌封胶 黏度 Epoxy resin Al2O3 thermal conductivity potting adhesive viscosity
  • 相关文献

参考文献8

二级参考文献32

共引文献34

同被引文献61

  • 1姜秀杰,孙辉先,王志华,张利.商用器件的空间应用需求、现状及发展前景[J].空间科学学报,2005,25(1):76-80. 被引量:26
  • 2周文英,齐暑华,李国新,牛国良,寇静利.导热胶粘剂研究[J].材料导报,2005,19(5):26-29. 被引量:23
  • 3马孝松,陈建军.底充胶导热系数预测及对倒装焊温度场的影响[J].西安电子科技大学学报,2006,33(1):103-106. 被引量:2
  • 4佟川,曾声奎,陈云霞.塑封球栅阵列焊点热疲劳寿命预测有限元方法[J].焊接学报,2007,28(10):89-92. 被引量:13
  • 5LEE E S, LEE S S, SHANEFIELD D J, et al. Enhanced Ther- mal Conductivity of Polymer Matrix Composite Via High Sol- ids Loading of Aluminum Nitride in Epoxy Resin[J]. Journal of the American Ceramic Society, 2008,91 (4) : 1169-1174.
  • 6PATEL H S, NAJI A M. Composites of Poly (keto-sulfide) Resin Systems and Their Thermal and Mechanical Properties [J]. International Journal of Polymeric Materials and Polymeric Biomaterials, 2010,59(3) : 215-229.
  • 7HU Min, YU De-mei, WEI Jian-bo. Thermal Conductivity D- etermination of Small Polymer Samples by Differential Scan- ning Calorimetry[J]. Polymer Testing, 2007,26 (3) : 333-337.
  • 8WARREN M, ROHSENOW H. Handbook of Heat Transfer [M]. Beijing: Science Press, 1985.
  • 9WILLIAM E, RAVI P, JACOB F, et al. Effect of Aggregation and Interracial Thermal resistance on Thermal Conductivity of Nanocomposites and Colloidal Nanofluids[J]. International Journal of Heat and Mass Transfer, 2008, 51 (5/6) : 1431- 1438.
  • 10LI Tung-lin, CHUNG H S L. Enhanced Thermal Conductivity of Polyimide Films Via a Hybrid of Micro-and Nano-sized Boron Nitride[J]. The Journal of Physical Chemistry B, 2010, 1 l 4(20) : 6825-6829.

引证文献7

二级引证文献32

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部