芳香羧酸对锡电沉积的影响

Effect of aromatic carboxylic acid on tin electrodeposition

通过测定循环伏安曲线、锡镀层的表面形貌和X射线衍射谱图,研究了苯甲酸、苯乙酸、苯丙酸、苯丁酸等几种芳香羧酸对锡电沉积的影响。结果表明,芳香羧酸对锡还原的阴极过程有抑制作用。随芳香羧酸碳链长度的增大,该抑制作用增强。烷基糖苷与芳香羧酸之间具有协同作用,烷基糖苷使芳香羧酸对Sn2+向阴极扩散和锡电沉积阴极过程的抑制作用增强。镀液中同时加入烷基糖苷和芳香羧酸时,所得镀层表面平整,结晶细致、均匀。

The effects of several kinds of aromatic carboxylic acid including benzoic acid, phenylacetic acid, 3-phenylpropionic acid and phenylbutyric acid on tin electrodeposition were studied through cyclic voltammetry, surface morphology observation, and X-ray diffraction analysis. The results showed that aromatic carboxylic acid has an inhibitory effect on the cathodic process of tin electrodeposition, and the inhibitory effect is enhanced with increasing the length of alkyl chain. There is a synergy between alkyl polyglycoside and aromatic carboxylic acid. Alkyl polyglycoside enhances the inhibitory effect of aromatic carboxylic acid on the Sn2~ diffusion to cathode as well as the cathodic process of tin electrodeposition. The tin coating prepared from a bath containing aromatic carboxylic acid and alkyl polyglycoside has a smooth surface and is compactly and uniformly crystallized.