摘要
毫米波有源相控阵射频前端工艺集成度高,立体组装、先进封装材料、TR组件热路设计和芯片技术是实现有源相控阵射频前端集成制造的关键技术。综合国内外研究发展现状,系统封装、综合集成以及多功能芯片技术是有源相控阵射频前端集成制造技术的未来发展趋势。
The manufacturing technology for RF front-end of Millimeter-wave Active Phased Array is highly integrated. Combined with the development in the world, the technology of Three-dimensional assembly, advanced packaging materials, thermal circuit design for TP, module, and multi-function chip technology are key technologies. As a summary, system in package, comprehensive integration and multi- function chip technology are the future development trend of integrated manufacturing technology.
出处
《机电产品开发与创新》
2013年第6期11-13,16,共4页
Development & Innovation of Machinery & Electrical Products
关键词
毫米波有源相控阵
射频前端
集成制造
millimeter active phased array
RF front-end
integration technology
