摘要
电子装备生产的日益规模化对科学性的控制管理方法要求越来越高。提出将统计学应用于生产制造中,并实践应用统计方法,对薄膜制造中的集成电阻精度、图形转移精度和基片外形破碎率等项内容进行了过程能力的分析评价。根据分析结果制定和实施了优化方案,取得了满意效果。
With the rapid development of electronic device, the scientifc control method is Put forward. Use statistics to analyze thin flm manufacture process is available. The process such as resistor precision control, graphics precision, and substrate break ratio were analyzed by SPC. According to the analysis results, the optimization plan was set out and carried out,and the satisfactory results were obtained.
出处
《电子工艺技术》
2013年第6期363-366,共4页
Electronics Process Technology
关键词
6σ
薄膜
过程控制
过程能力
6σ
Thin film
Process control
Process capability
