光学元件微纳加工亚表面损伤去除特性分析

Research on Optical Element Processing of Subsurface Defect Analysis and Experimental Method

针对光学元件加工过程中产生的亚表面损伤(SSD),回顾了几种SSD表征技术以及材料去除机理,通过实验重新评价不同材料的公式可行性,分析其误差较大的原因.在此基础上,提出了修正后的材料去除公式.实验表明,修正后的材料去除率(MRR)误差波动范围大幅减小,可以通过材料去除公式严格控制加工参数,实现最大效率的SSD去除;同时,对元件表面进行分步蚀刻,利用光学显微镜和扫描电子显微镜(SEM)观察SSD的形貌,实验结果表明光学元件产生的SSD深度随刻蚀时间不断变化,裂纹的宽度及形状也随着刻蚀时间不断变化,分步优化腐蚀及显微镜观测的方法,不仅有效地简化了检测步骤,而且准确率高.

In order to research the subsurface defects（SSD） of optical elements,we use chemical mechanical polishing（CMP） method to verify the material removal rate（MRR） formula feasibility based on the LUO＇s material removal mechanism. Experimental results showed that the revised MRRrs error fluctuating range greatly decrease. Through the material removal formula, we can strictly con- trol the processing parameters, achieve maximum efficiency surface defect removal~ At the same time, we research the depth and mor- phology of surface defects. According to the step etching preferred method,we investigate the morphology of SSD by optical micros- copy and scanning electron microscopy （SEM）. The results of experiments show that the SSD is vary with time. This method is not only effective simplified the testing methods, but also have high accuracy.