废印刷电路板基材填充聚丙烯的界面改性研究

Study on Surface Modification of Wasted Printed Circuit Board Basement Filled PP

利用双马来酰亚胺(BMI)与马来酸酐接枝聚丙烯(PP-g-MAH)作为界面处理剂,采用熔融共混的方法制备了聚丙烯/废旧印刷电路板(PP/WPCB)复合材料,测试了复合材料的力学性能,并观察了复合材料的断面形貌。结果表明:BMI和PP-g-MAH的加入提高了PP与WPCB基材的界面结合强度,复合材料力学性能与纯PP相比有所提高,特别是冲击强度,最大增幅为137%;WPCB起到了增强增韧作用,实现了废弃资源的再利用。

Taking BMI and PP-g-MAH as interface treating agent, PP composites filled with wasted printed circuit board basement were prepared by melt blending. The mechanical properties of composites were investigated and the morphology of fracture surface was observed. The results show that the interface bonding strength between the WPCB basement and the PP improves with the addition of the BMI and PP-g-MAH; compared with pure PP, the mechanical properties of PP composites improve, especially the impact strength increases by 137%. It is proved that WPCB has strengthening and toughening effect on PP, and the reuse of waste resources is realized.