SMT连接器的翘曲分析

The Warpage Analysis for SMT Connector

SMT类连接器由于其特殊的安装工艺,对连接器翘曲有着较高的要求。本文通过对一种CPU插座的翘曲分析,从产品结构、原材料特性等方面找到改善翘曲的方法。该方法同样可应用于其它SMT连接器的翘曲改善。

Due to the special installation process, SMT type connectors requested a higher level warpage. Based on a CPU -socket, from the product structure, material properties, etc. to find ways to improve warpage This method is also applicable to other SMT connectors type.