摘要
太赫兹波处在亚毫米波与远红外光之间,应用于无线通信具有比微波通信更大的传输带宽和传输速率,在大数据无线通信等方面具有巨大的应用潜力。特征频率逐渐达到太赫兹频段的硅基集成电路工艺,为高集成度低成本太赫兹通讯电路的实现提供了可能。本文综述了近年来硅基太赫兹集成电路的研究进展,论述了硅基太赫兹集成电路设计在有源器件模型、互连结构、电路设计方法等方面面临的挑战,并对硅基太赫兹集成电路的发展趋势进行了讨论。
The terahertz-wave, located between sub-mm-wave and infrared ray, presents a broad application prospects include mass-data wireless communication, while the rapid progress on silicon-based technology provides process foundation for terahertz integrated circuits with small size, high-integration and low cost. An overview was made on the research progress of terahertz integrated circuits based on silicon-based technology, and the challenges and trend of terahertz integrated circuits based on silicon-based technologies also discussed.
出处
《微波学报》
CSCD
北大核心
2013年第5期43-48,共6页
Journal of Microwaves
基金
国家自然科学基金(60671057)
国家重点基础研究发展计划(973)课题(2010CB327403)
关键词
硅基
太赫兹
集成电路
silicon-based, terahertz, integrated circuits