摘要
Copper nanoparticles with a size of about 150 nm were prepared in toluene using oleic acid as protecting agent. The nanoparticles were used to prepare conductive Cu ink with a polyurethane binder. Oleic acid was used to prevent the nanoparticles from oxidization and agglomeration. The prepared Cu nanoparticles were characterized by X-ray diffraction （XRD） and transmission electron microscopy （TEM）. The resistivity of the copper film on glass substrate that was prepared using Cu nanoparticle ink reached about 1.5× 10-4 2. cm-1 after it was annealed to 120 ~C. Both the nanoparticle ink and the films were characterized by XRD, fourier transform infrared （FT-IR）, and the thermogravimetry-differential scanning calorimetry instrument （TG- DSC）.
Copper nanoparticles with a size of about 150 nm were prepared in toluene using oleic acid as protecting agent. The nanoparticles were used to prepare conductive Cu ink with a polyurethane binder. Oleic acid was used to prevent the nanoparticles from oxidization and agglomeration. The prepared Cu nanoparticles were characterized by X-ray diffraction （XRD） and transmission electron microscopy （TEM）. The resistivity of the copper film on glass substrate that was prepared using Cu nanoparticle ink reached about 1.5× 10-4 2. cm-1 after it was annealed to 120 ~C. Both the nanoparticle ink and the films were characterized by XRD, fourier transform infrared （FT-IR）, and the thermogravimetry-differential scanning calorimetry instrument （TG- DSC）.
基金
Funded by the National Natural Science Foundation of China(No.51175394)
the Fundamental Research Funds for the Central Universities(No.2013-Ia-031)
the Scientific Research Foundation for the Returned Overseas Chinese Scholars(Nos.[2012]1707,[2013]693)
