摘要
研究了时效处理对Sn-0．7Cu无铅钎料显微组织的影响，结果表明：在时效过程中β-Sn初晶晶粒长大，网状Sn—Cu微细二元共晶组织消失，Cu6Sn5金属间化合物颗粒的数量减少、尺寸增大，并且颗粒间距增大。对钎料的力学性能测试表明：时效时间在0～50h范围时，随着时效时间的增加，钎料的抗拉强度急剧降低，此后随着时效时间的增加，钎料的抗拉强度没有显著变化；钎料的断后延伸率在时效0—100h范围时，随着时效时间的增加而升高，此后随着时效时间的增加，没有显著变化。
The microstructure evolution process of Sn-0.7Cu lead-free solder during aging treatment was studied.Experimental results confirmed that β-Sn primary grains grow in the aging process,and the Sn-Cu binary eutectic structure disappears,the amount of Cu_6Sn_5 intermetallic particles decreases,and the particle size and spacing increase.The mechanical properties tests of solders showed that,when the aging time is in the 0- 50 h range,the tensile strength of solder decreases sharply with the increase of aging time,then with the increase of aging time.Solder tensile strength does not change significantly.When the aging time was in the 0-100 h range,the elongation of solder increases with the increase of aging time,then with the increase of aging time,the elongation of solder does not change significantly.
出处
《焊接》
北大核心
2013年第11期16-19,69,共4页
Welding & Joining
基金
863国家高技术研究发展计划(2012AA040208)
