1.10-菲啰啉在以HCHO为还原剂的化学镀铜体系中的作用

Effect of 1.10-phenanthroline on Electroless Copper Plating Using Formaldehyde as Reductant

通过实时分析镀液中HCHO含量,结合极化曲线、电化学阻抗谱及扫描Kelvin探针技术,研究了1.10-菲啰啉对化学镀铜液中HCHO利用率及镀层沉积行为的影响;采用SEM,XRD分析铜镀层微观形貌及结构。结果表明:1.10-菲啰啉能够加速HCHO的氧化,提高HCHO利用率;化学镀铜液中加入1.10-菲啰啉,能够明显降低镀液阻抗,提高混合电位下的自腐蚀电流密度,降低Cu在镀液中的表面电势,提高镀层沉积速率。镀液中加入1.5 mg·L-11.10-菲啰啉可使HCHO利用率从28%提高到39%,镀速增加50%;1.10-菲啰啉的加入可以提高Cu(111)晶面的择优取向程度,获得细致均匀的铜镀层。

The effects of 1.10-phenanthroline on the utilization of formaldehyde and copper deposition behavior during electroless copper plating was studied by measurement of the formaldehyde in electrolyte in real-time, polarization curves, electrochemical impedance spectroscopy （EIS） and scanning Kelvin probe （SKP）. The morphology and microstructure of copper coating was characterized by SEM and XRD. The results showed that 1.10-phenanthroline can accelerate the oxidation of formaldehyde and increase the utilization of formaldehyde. When 1.10-phenanthroline was added to electrolyte, the resistance of electrolyte reduced, the current density at mixed potential increased, the surface potential of copper at electrolyte moved negatively, and then the copper deposition rate increased. The utilization of formaldehyde rose from 28% to 39%, the deposition rate increased by 50% when 1.5 mgL-1 1.10-phenanthroline was added to electrolyte. Besides, 1.10-phenanthroline is helpful to obtain uniform and fine copper coating, and increases the preferred orientation of Cu（111）.