基于DSP的高精度电子灌胶机出胶系统的设计与实现

Design and Implementation of a High Precision Glue System in Electronic Glue Machine Based on DSP

从分析电子灌胶机出胶系统中存在的问题出发,介绍了一种基于DSP处理器的高精度高实时性电子灌胶机出胶系统的设计与实现,文中详细描述了出胶系统的设计结构、控制结构和工作流程,并详细论述了出胶系统中加热功能和出胶控制功能的设计与实现;由于DSP处理器具有高运行速度、强数据处理能力、高运算精度等特点,并且系统采用了独特的出胶方案,使系统实际测试的最大出胶量误差仅为±1g,有效地改善了一般电子灌胶机出胶系统出胶量控制误差大、实时性较差的问题。

From the analysis of glue system problems in electronic glue machines,this paper introduced a kind of the design of glue system with high precision and high real time based on the DSP processor used in electronic glue machine,and describes in detail the design structure,control structure and work flow of the glue system,this paper discusses in detail the design and implementation of heating function and glue control function in the glue system.Because DSP processor has the high running speed,strong data processing ability,high operation accuracy and so on,and the system uses a unique glue solution,so the maximum glue volume error of the actual system tests only is± 1g,effectively improved the problems exist in the general electronic glue machine that the glue quantity error is large,real-time is poor.