摘要
为了在T10A钢表面得到厚度薄且孔隙率较低的化学镀镍层,运用单因素分析法,考察了施镀温度、施镀时间、硫酸镍质量浓度和次磷酸钠质量浓度对化学镀镍层厚度及孔隙率的影响,并初步得到各因素指标的适宜浓度范围。在此基础上,通过正交试验法,确定了化学镀镍的最优工艺配方:硫酸镍25g/L,次磷酸钠25g/L,醋酸钠25g/L,辅助配位剂25g/L,光亮剂2g/L,硫脲2mg/L,pH=4.0,施镀温度70℃,施镀时间10min。正交试验的极差分析表明:在施镀温度、施镀时间、硫酸镍质量浓度和次磷酸钠质量浓度4个因素指标中,硫酸镍质量浓度对于镀层厚度、孔隙率及镀层显微硬度的影响都最大;且采用该化学镀镍配方,可获得孔隙率为12点/cm2,镀层厚度为4.1μm及镀层显微硬度为487HV0.1的镀层。
To obtain slight and low porosity eletroless nickel coating on T10A, the effects of temperature, time, nickel sulfate, and sodium hypophosphite on thickness of the coating and porosity rate were studied u- sing single-factor tests. The pleasant range of influencing factors was first obtained. Through orthogonal ex- perimental design, an optimal bath formulation for electroless nickel plating was then determined as follows.. nickel sulfate 25 g/L, sodium hypophosphite 25 g/L, sodium acetate 35 g/L, auxiliary complex-former agent 30 g/L, polish 2 g/L, sulfocarbamide 2 mg/L, pH 4.0 and temperature 70 ℃. The results show that the con- centration of significantly influenced the thickness of the coating, porosity rate and hardness; the electroless- nickel-plating with the porosity of 12 points per cmz , thickness of 4.1 t,m and hardness of 487 HV0.1 can be obtained.
出处
《中国表面工程》
EI
CAS
CSCD
北大核心
2013年第6期63-69,共7页
China Surface Engineering
关键词
T10A钢
化学镀镍
镀层厚度
孔隙率
正交试验
TIOA
electroless nickel plating
thickness of coating
porosity
orthogonal experimental design