平面磁控溅射靶磁场的模拟优化设计

Simulation and Optimization of Magnetic Field for Planar Magnetron Sputtering Target

平面磁控溅射靶面水平磁感应强度对靶材刻蚀均匀性及其利用率等有着重要作用。为了提高靶面水平磁感应强度均匀性,在传统磁控溅射平面靶结构基础上,提出了一种采用加装两导磁片的结构,通过ANSYS软件模拟,得出采用不同尺寸及位置的导磁片时的靶面水平磁感应强度分布规律。结果表明,当采用适当的导磁片厚度、导磁片间距及导磁片与内外磁钢距离时,能有效改善靶面的水平磁感应强度均匀性,提高靶材的利用率。同时,通过模拟分析了距靶面不同距离的截面磁场强度分布对靶材刻蚀轮廓的影响。

A novel design of the magnetic field for the planar magnetron sputtering target was developed to improve the target utilization and uniformity by optimizing the horizontal component of the trmgnetic flux density on the surface of the target. The newly-developed target modified the conventional target with the two ferromagnetic shunt shims （FSS）. The impacts of the geometry and location of the two FSS on the horizontal magnetic flux density distribution on the target sur- face were simulated with software package ANSYS. The simulated results show that the thickness of the two FSS and its distance from the permanent magnet effectively improve the uniformity of the horizontal magnetic flux density distribution and utility etiqciency of the target. Besides, the influence of the cross-sectional magnetic field distribution at different dis- tances from the target surface on the sputtered target profile was also simulated.