摘要
喷墨打印阻焊剂自研发以来,因树脂油墨剪切变稀和触变性等特点,一直不能有效解决阻焊剂喷墨初始阶段稳定性问题。对此,本研究以Boltorn H20为原料,合成了一种超支化丙烯酸化合物,在与TMP3EOTA及UV固化剂混合后,可以获得稳定性好的阻焊油墨,在光源照度1 w/cm2条件下固化速度低于20 s,固化膜的热分解温度超过300℃,阻焊膜的其他性能符合IPC-SM-840C和CPCA 4306-2011等相关标准。
As printable solder resist has been researched recently, the solder mask prepared by ink-jet printing technology shows unstable properties and uneven linewidth due to resins possess shear-thinning nature and thixotropy. A novel hyperbranched acrylate polyester resin was synthesized with Boltorn H20. The resin was mixed with TMP3EOTA and UV curing agent to prepare solder resist ink. The ink was cured under 1 w/cm2 UV light source and the duration of curing was less than 20s. The cured mask was degraded over the temperature of 300℃ and also satisfied the standard of IPC-SM-840C and CPCA 4306-2011.
出处
《印制电路信息》
2013年第12期18-21,共4页
Printed Circuit Information
关键词
喷墨打印
阻焊剂
超支化树脂
低黏度
Ink-jet Printing
Solder Resist
Hyperbranched Polyester
Low Viscosity
