电镀锡工艺成本的管理与改善

Tin plating process management and cost down improvement

在印制电路板制程中,有采取图形电镀铜/锡,碱性蚀刻的办法形成线路图形;锡层仅仅是作为碱性蚀刻的保护层,在蚀刻形成线路后,用硝酸退锡剂将其处理掉。文章首先,从镀锡工艺的加工参数方面进行着手,结合碱蚀工序的加工特点,结合产品的设计特点,分析锡层合理厚度。其次,从电镀锡工艺的物料使用方面分析是采用锡球还是锡棒,哪种成本更合理,操作更简便,产品质量更有保证。

In PCB processing, some process takes graphics electroplating copper/tin and alkaline etching solution to form line graphics. Tin is just as protective layer of the alkaline etching, in forming line, with nitrate annealing tin agent to get rid of it. In this paper, first of all, from the aspects of tin plating process of machining parameters on hand, it combines with the characteristics of alkali corrosion process of processing and combining with the characteristics of product design and reasonable analysis of tin layer thickness. Secondly, from the electroplating tin process analysis of the material used, it decides which cost is more reasonable, more convenient operation, product quality has the guarantee.