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含界面裂纹的压电智能梁断裂分析

Fracture analysis of an interfacial crack in a piezoelectric smart beam
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摘要 针对压电智能梁界面裂纹的应力和基于能量原理的断裂行为进行了理论研究.基于Timoshenko梁理论,提出了一个压电智能梁界面断裂问题的分析模型,该模型考虑了胶层的影响,其中胶层采用考虑剥离和剪切刚度的连续弹簧模型,并推导了相应的控制方程,得到了界面剥离应力、剪切应力和能量释放率的解析解,通过实验和文献结果比较证明了解的有效性,通过典型算例分析表明:裂尖剥离应力和剪切应力的值处于同一量级,在预测压电智能梁界面断裂行为时,不能忽略电压作用下界面剥离应力产生的I型断裂. The stress analysis and fracture behavior on the basis of the energy principle for an interfacial crack in a piezoelectric smart beam was studied in theory. Based on the Timoshenko beam theory, an analytical model was de- veloped for the piezoelectric smart beam with consideration to the adhesive layer, in which the adhesive layer was modeled as a continuous spring with the shear and peel stiffness, the governing equations for the piezoelectric smart beam were formulated firstly, and then analytical solutions were obtained for calculating inteffacial peel stress or and shear stress ~" and mode I and II energy release rates (EERs) GI and GII, respectively. The present solutions were verified by experiment results and those available in the literatures. The results indicated that the values of the peel stress of the crack tip and the shear stress are in the same order of magnitude, and the mode I fracture cannot be ig- nored for the prediction of interracial fracture behavior in the piezoelectric smart beam.
出处 《哈尔滨工程大学学报》 EI CAS CSCD 北大核心 2013年第11期1427-1431,共5页 Journal of Harbin Engineering University
基金 国家自然科学基金资助项目(10872038)
关键词 压电智能梁 界面裂纹 能量释放率 胶层 断裂分析 piezoelectric smart beam interracial crack energy release rate adhesive layer fracture analysis
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参考文献12

  • 1DU T B,LIU M,SEGHI S. Piezoelectric actuation of crack growth along polymer-metal interfaces in adhesive bonds[J].Journal of Materials Research,2001,(10):2885-2892.
  • 2SHANG F,KITAMURA T,HIRAKATA H. Experi-mental and theoretical investigations of delamination at free edge of interface between piezoelectric thin films on a sub-strate[J].International Journal of Solids and Structures,2005,(5/6):1729-1741.doi:10.1016/j.ijsolstr.2004.08.004.
  • 3BAI R X,WANG L,LEI Z K. Experimental and nu-merical analysis of interfacial fracture in piezoelectric com-posites[J].Optoelectronics and Advanced Materials-Rapid Communications,2011,(12):1328-1335.
  • 4WANG X D,MEGUID S A. On the electroelastic behavior of a thin piezoelectric actuator attached to an infinite host structure[J].International Journal of Solids and Structures,2000,(23):3231-3251.doi:10.1016/S0020-7683(99)00118-3.
  • 5LIU M,HSIA K J. Interfacial cracks between piezoelectric and elastic materials under in-plane electric loading[J].Journal of the Mechanics and Physics of Solids,2003,(05):921-944.doi:10.1016/S0022-5096(02)00120-5.
  • 6LUO Q,TONG L. Exact static solutions to piezoelectric smart beam including peel stress. Part I:theoretical formu-lation[J].International Journal of Solids and Structures,2002,(08):4677-4695.
  • 7JIN C,WANG X D. Analytical modeling of the electro me-chanical behavior of surface-bonded piezoelectric actuators including the adhesive layer[J].Engineering Fracture Me-chanics,2011,(13):2547-2562.
  • 8IM S,ATLURI S N. Effects of a piezo-actuator on a finite deformation beam subjected to general loading[J].AIAA Journal,1989,(12):1801-1807.
  • 9LI X F,FAN T Y,WU X F. A moving mode-III crack at the interface between two dissimilar piezoelectric materials[J].International Journal of Engineering Science,2000,(11):1219-1234.
  • 10LI X F,TANG G J. Antiplane interface crack between two bonded dissimilar piezoelectric layers[J].European Journal of Mechanics A/Solids,2003,(02):231-242.doi:10.1016/S0997-7538(03)00028-7.

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