铜电子浆料的研究发展现状

Research Progress and Developments of Conductive Copper Paste

铜电子浆料中铜粉具有高的导电性且价格低廉容易获得,但是由于其在高温时容易氧化,因此如何提高铜粉的表面抗氧化性成为近年来的研究热点。本文综述了铜电子浆料的发展状况,主要包括导电铜浆的制备;超细铜粉表面氧化原理;铜粉表面改性技术,并对铜粉表面改性技术的不足和铜电子浆料的应用前景进行了展望与总结。

The copper powder in copper conductive paste is high conductivity, cheap and readily available. However, the anti-oxidant of Cu powder has been focus on studying in recently years because of the oxidation of Cu powder at elevated temperature. The paper presents the research progress and development tendency of conductive copper paste, including the preparation of copper conductive paste, the oxidation theory of ultrafine copper powder and modifying technology of Cu powder. The disadvantage of modifying technology has been presented and the application prospect has been also summarized.