摘要
可靠性预计通常是按照GJB/Z 299C-2006《电子设备可靠性预计手册》进行计算的。通过实测壳温,一种快速热仿真的方法确定了功耗的初始值,利用仿真软件FloTHERM来实现对结温的精确计算;将通过温度校正的仿真结果中的结温代到可靠性预计软件CARMES 5.0中进行分析。与基于预计手册中提供热阻的可靠性预计方法对比,由于该方法考虑了更多的散热途径因而得到的故障率更加精确。该计算结温的方法在热仿真和可靠性预计之间架起了数据交互的通道。
Generally, reliability prediction is based on GJB/Z 299C-2006 ＂ Electronic Equipment Reliability Prediction Manual＂ . In this study, with the measured case temperature, a rapid thermal simulation method can be used to determine the initial value of power consumption and ultimately calculate the accurate temperature with simulation software FloTHERM. And the simulated junction temperature is directly substituted into the reliability prediction software CARMES 5.0. Compared with the handbook-based thermal resistance prediction, the proposed method is more accurate, since it takes into account more thermal paths. This method is expected to set up a bridge of data exchange between the thermal simulation and reliability prediction.
出处
《电子产品可靠性与环境试验》
2013年第A01期66-70,共5页
Electronic Product Reliability and Environmental Testing
关键词
热阻
导热率
对流系数
壳温
结温
快速热仿真
thermal resistance
thermal conductivity
convection coefficient
case tempera-ture
junction temperature
rapid thermal simulation
