摘要
IC封装不仅要求封装材料具有优良的导电性能、导热性能以及机械性能,还要求具有高可靠性、低成本和环保性,这也是引线框架、环氧树脂成为现代电子封装主流材料的主要原因,其市场份额约占整个封装材料市场的95%以上。由于环氧树脂封装是非气密性封装,对外界环境的耐受能力较差,尤其是受到湿气侵入时,产品会出现一些可靠性问题,最容易发生的现象是分层。简要分析了框架和环氧树脂对产品可靠性的影响,在此基础上提出一些改善措施。
IC package materials are not only with electrical conductivity, thermal conductivity and excellent mechanical properties, but also high reliability, low cost and environmental protection. So, lead frame and molding compound as main materials of IC package,accounts for over 95% of the whole package materials. But because the Plastic packaging is non hermetic package,it was easily affected by the external environment,especially when moisture entrained into the package will lead to products failure,such as delaminating. This paper briefly analyzes lead frame and molding compound impact on the reliability of the product,and improving measures are put forward.
出处
《电子工业专用设备》
2013年第12期1-5,30,共6页
Equipment for Electronic Products Manufacturing
关键词
环氧树脂
封装
分层
molding compound
package
delaminating
