镀金黄铜基板上金丝键合拱高测量及控制技术

Bond Height Measure and Control of Wire Bonding on Gold-plated Brass

引线键合是多芯片微波组件微组装中常用的工艺,通常都会以一定拱弧实现芯片与基板、基板与基板间的互连。如何进行拱高的测量和控制对引线键合有着重要意义,因为拱高的大小还会对微波性能产生重要的影响。文中利用自动键合机获得若干组引线,采用光学测量方法,在放大40倍的状态下分别进行了不同工艺参数下的拱高测量,得出结论在测试范围内,拱度随着弧长的增加而增加,同时还获得了一组适用于微波应用的键合参数。

Wire bonding process is widely used in microwave multi-chip module for joining chip to substrate or substrate to substrate with given curve, which the highest point to substrate named as bond height. It is valuable to develop bond height measure and control of wire bonding because it has important effects on microwave performance. In this article, groups of wires done with automatic bonding machine is optical measured by zooming in 40 times, then bond height increases with wire length by the test, meanwhile, a group of parameters is gained for assembly in microwave multi-chip module.