纳米Ni颗粒对时效过程中钎焊界面组织的影响

Effect of Ni nanoparticles on soldering interfacial microstructure during aging treatment

分别采用低温搅拌钎焊和润湿平衡法对Sn-Cu-Ag亚共晶钎料及其纳米复合钎料进行钎焊,并对其进行时效处理。结果发现:纳米Ni颗粒有利于金属间化合物(IMC)的形成,在钎焊界面形成孔洞状的(Cux Ni1-x)6Sn5;采用低温搅拌钎焊工艺时,时效过程中两种接头的IMC厚度与时效时间t的拟合直线完全重合,纳米颗粒对IMC结构的改变作用不明显;采用润湿反应钎焊工艺,添加颗粒后钎料中元素互扩散系数降低一个数量级,纳米颗粒对时效过程中IMC的生长有明显的抑制作用。

Soldering with Sn-Cu-Ag eutectic solder or its composite solder by low-temperature stirring soldering and wetting balance method were implemented respectively, and the aging treatments were performed. The results show that the nano-Ni particles are beneficial to the formation of IMC, and the hole shape （CuxNi1-x）6Sn5 forms in the soldering interface. With low-temperature soldering process, the fitting line of the IMC thickness and aging time t is totally coincident in two soldering joint, and the structural change of the IMC due to adding nano-particles is not obvious. With the wetting balance test method, the mutual diffusion coefficient reduces by an order of magnitude after adding nanoparticles, the nano-Ni particles are beneficial to inhibiting the growth of IMC.