电脑硬盘磁头晶片金凸块电镀研究

Study on Au Pad Plating on HDD Head Wafer of Computer

探讨了将电脑硬盘磁头晶片金凸块直接电镀在Ni-Fe合金种子层上,以减少焊接时金凸块变形,从而获得性能优良的磁头。实验在两种不同基材的晶片上沉积不同的种子层,经多种电镀前处理后分别电镀不同厚度的金凸块。通过拉扯试验,检查金凸块与基体的结合力。实验结果表明,不能直接在Ni-Fe合金种子层上电镀金凸块,在Ni-Fe合金种子层上溅射一层薄的金层即可实现金凸块电沉积在Ni-Fe合金种子层上,拉扯试验测试达到合格。

Whether Au Pad could be plated direcdy on Ni-Fe seed-layer of HDD Head was investigated for improving bonding properties of the Au Pad.Different seed-layers were deposited on wafer of two types of substrates,with a variety of activation methods prior to plating,Au Pad with different thickness were plated,and then check bonding force between the Pad and substrate.Results showed that Au Pad could not be plated directly on Ni-Fe seed-layer,but could be electrodeposited on Ni-Fe seed-layer by sputtering an additional thin layer of gold on Ni-Fe seed-layer prior to plating,in so doing,pull test could be passed.