分子自组装法制备具有可控浸润性的铜表面

Preparation of Copper Surfaces with Controlled Wettability Through the Molecular Self-assembling Process

通过简单浸泡的方法在铜基底上制备出了具有微纳米复合结构的氧化铜,再利用混合硫醇溶液[含HS(CH2)9CH3和HS(CH2)11OH]对浸泡后的表面进行修饰,通过控制溶液中HS(CH2)11OH的浓度,制备出一系列具有不同浸润性的铜表面,实现表面从超疏水到超亲水的有效调控.研究发现,表面浸润的可控性源于表面复合结构与不同化学组成的协同作用,微纳米复合结构的存在为表面浸润性的调节提供了必要的条件.

We report a novel method for the fabrication of copper surfaces with controlled wettability. Through modification of the nanostructured copper substrates with mixed thiol molecules of HS（CH2）9CH3 and HS（CH2）11OH, surfaces with controlled wettability from superhydrophobicity to superhydrophilicity can be achieved by simply controlling the concentration of HS（CH2 ）11 OH in the modified solution. The controllability of the surfaces wettability can be ascribed to the combined effect of the surface chemistry variation and the hi- erarchical micro/nanostructures on the substrates. Especially the presence of hierarchical micro/nanostruc- tures, which can provide a better control of the surface wettability between the two extremes： superhydropho- bicity and superhydrophilicity.