大面积薄板回流焊工艺的优化设计

Optimum design of large area sheet reflow soldering

为解决电子产品中大面积薄板对焊易产生焊接缺陷等问题,尝试采用圆形及方形开孔模版进行印刷,研究了印刷模版、印刷和回流焊工艺。采用X射线断层扫描对焊接面进行了检测分析,结果表明:圆形孔设计较方形孔设计产生的焊接面缺陷减少23.5%,且使用分步印刷结合三段式升温方法可以进一步减少焊接面缺陷。

In order to solve soldering flaws of large area sheets in electronic devices, square holes and circular holes templates were applied in printing modules. After printing and reflow soldering process, the soldering interface was scanned by X-ray computed tomography. The results show that compared with square holes design, the defects of soldering surface made by circular holes design reduce by 23.5%. The defects are further reduced in the way of step-by-step printing and three-stage increasing temperature.