期刊文献+

不同负载条件下航天继电器接触失效机理分析 被引量:9

Analysis of Contact Failure Mechanism of Aerospace Relays
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摘要 提出了通过在线监测退化参数,获取继电器接触失效信息的研究方法。首先给出了航天继电器可靠性寿命试验的试验条件,论述了航天继电器接触失效的两种失效模式及其机理,分析了不同负载类型下航天继电器的触点表面形态和退化参数变化趋势,获得了退化参数反映继电器退化过程的动态信息,最后给出了失效机理分析后的结论,并对以后的工作提出一些想法和建议。 This paper proposed a method that the failure information can be acquired through on-line monitoring the degradation parameters. The paper gave the condition of life test, elaborated two contact failure modes of aerospace relays, and analyzed the surface of the contact and the tendency of the degradation parameters in different load types. And digging in deep degradation parameters to reflect the dynamic information relays' degradation process. Finally, the paper proposed conclusions after the analysis, and gave some suggestion and ideas for future work.
出处 《低压电器》 2013年第23期14-19,共6页 Low Voltage Apparatus
基金 总装"十二五"预研项目(51323060304)
关键词 继电器 接触失效机理 退化参数 不同负载 relay contact failure mechanism degradation parameter different loads
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参考文献7

  • 1朱永庆,吴世湘.军用继电器的发展态势[J].电子科学技术评论,2005(1):55-56. 被引量:17
  • 2王淑娟,余琼,翟国富.电磁电器接触失效机理判别方法研究[J].电工技术学报,2005(3):91-97.
  • 3JEMMA N B,NEDELEC L, BENHENDA S. Break arc duration and contact erosion in automotive application [J]. IEEE Transactions on Packing and Manufacturing Technology, 1996,19 ( 1 ) : 82-86.
  • 4CHEN Z K, SAWA K. Polarity effect of unsymmetrical material combination on the arc erosion and contact resistance behavior [ J ]. IEEE Transactions on Components, Packing and Manufacturing Technology, 1995,18 (2) : 334-343.
  • 5CHEN Z K, WITI'ER G. Acomparison of contact erosion for opening velocity variations for 13 volt circuits: proceedings of the 52th IEEE Holm Conference on Electrical Contacts, 2006 [ C ]. 2006 : 15-20.
  • 6NEUHAUS A R, RIEDER W F. The influence of kinetic parameters on failure mechanisms caused by material transfer: proceedings of the 50~h IEEE Holm Conference on Electrical Contacts, 2004 [ C ]. 2004 : 528 -534.
  • 7CHEN Z K, SAWA K. Effect of arc behavior on material transfer: A review [ J ]. IEEE Transactions on Components, Packing and Manufacturing Technology, 1998,21 (:2) :310-322.

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