5YAM F K, HASSAN Z. Innovative advances in LED technology [J]. Microelectronics J,2005,36(2) : 129-137.
6CHAN P C H.Electronic packaging for solid-state lighting [C]// 6th Int Cord on Electronic Packaging Technology. Shenzhen, China ,2005:13-16.
7WANG C Y, LEE C C. A bonding technique for thin GaAs dice with via holes using gold-tin composites [J]. IEEE Trans on Compon Hybrids Manuf Technol, 1991,14(4) :874-878.
8KIM J S,CHOI W S,KIM D,et al. Fluxless Si-to-Al bonding using electroplated Au-Sn-Au structure at eltectic composition[J]. Materials Science and Engineering A, 2007,458 ( 1-2 ) : 101-107.
9BAHADUR M, NORRIS A W, ZARISFI A, et al. Silicone materials for LED packaging [J] .Pine of SPIE,2006:63370F.
10HAMID S H, USMANI A M. Applications of polymers in LED devices [J]. Polymer-Plastics Technology and Engineering, 1984,22(2) :156-176.
