基于层次分析法的微电子产品封装可靠性能模糊综合评判

AHP-based microelectronics packaging reliability fuzzy comprehensive evaluation

在微电子产品设计阶段,若使用层次法分析微电子产品各项性能,就可以保证在设计阶段优化产品设计和材料选择,改善工艺,从而减少可能的失效。文章通过对微软公司某款微电子产品封装可靠性的模糊评价发现,该电子产品的可靠性各项指标及综合性能都很好,并且从二级指标的评价中还看出机械可靠性虽然很好,但隶属度偏低,如果要优化该产品的封装可靠性可以从机械可靠性方面入手。文章首次将为层次模糊评价法应用在微电子封装领域,为封装设计提供理论基础和参考。

In the microeleetrunics product design stage, the use of hierarchical analysis of the performance of micro- electronic products, we can guarantee the design phase to optimize product desigu and material selection, prucess improve- ment, thereby reducing the possible failure. A section through the Microsoft article microelectronics packaging teliability fuzzy evaluation fouud that the reliability of electronic products and comprehensive peffurmance indicators are good, and the evaluation of the index from the two mechanical reliability is also seen, ahhough very good, but membership is low, if you want to optimize the reliability of the product package from mechanical reliability aspects. Article first level fuzzy e- valuation method will be applied in the fiehl of microeleclronics packaging, designed to provide a theoretical basis for the package and reference.