摘要
介绍了一种在陶瓷上镀耐高温、耐高真空的厚铜层焦磷酸盐镀铜工艺,其流程主要包括金属化预涂层、镀铜前处理、预镀铜、镀厚铜和后处理。介绍了各工序的工艺参数和操作规范。
A pyrophosphate copper plating process for forming thick copper coatings with heat and high-vacuum resistant on ceramic was introduced. The process flow mainly includes metallization by pre-painting, pretreatment, copper pre-plating, thick copper plating, and post-treatment. The process parameters and operation specification of each procedure were described.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2014年第1期15-16,共2页
Electroplating & Finishing
关键词
陶瓷
厚铜层
焦磷酸盐
电子器件
微波管
ceramic
thick copper coating
pyrophosphate
electronic device
microwave tube
