摘要
通过在铝中添加合金化元素Si,并对轧制复合铝合金/低碳钢双层复合材料进行不同温度和时间的退火,借助金相显微镜、扫描电镜和EDAX能谱仪,研究Si对轧制复合钢界面化合物生长行为的影响规律。结果表明,在Si含量为0.67wt%时,生成复合界面金属间化合物的临界温度达到615℃,此时Si对抑制界面化合物生成的效果最好;Si含量超过1.62wt%后,Si降低了Al-Si合金的熔点,使Al侧元素的扩散速率增加,促进了复合界面金属间化合物的长大,化合物的组成为τ6-Al8Fe2Si+τ5-Al4.5FeSi+η-Al5Fe2。
The A1-Si alloy/low-carbon steel clad plates bonded by cold-rolling were annealed at different temperatures and time. Silicon's effect on the formation of the intermetallic compound (IMC) in the interface was investigated by use of optical microscope( OM ) , scanning electron microscope (SEM) and EDAX energy dispersive spectrometer. The results show that the clad plates with 0.67wt% of Si additions have the best effect for preventing the growth of the IMC layer, which has the highest IMC critical forming temperature of 615 ℃. But when Si additions is more than 1.62wt%, it decreases the melting point of A1-Si alloy, increases the element diffusion rate in A1-Si alloy, accelerate the IMC growth, and the structures of IMC are %-A18 Fe2 Si + ,r5 -A14 5 FeSi + η-Al5 Fe2.
出处
《金属热处理》
CAS
CSCD
北大核心
2014年第1期20-26,共7页
Heat Treatment of Metals
基金
国家863计划(2013AA031301)
国际合作项目-火电空冷用预覆钎料多层铝钢复合材料联合研发(2013DF50170)
关键词
铝
低碳钢层状复合材料
SI含量
金属间化合物
临界温度
aluminum/low-carbon steel clad plates
Si additions
intermetallic compound
critical temperature