电子产品先进制造中的电气互联技术发展新动态

New Development Dynamic of Electrical Interconnection Technology in Advanced Electronics Manufacturing

电气互联技术是电子产品先进制造技术的典型技术,具有机电结合技术综合度高的特点。电气互联技术已经由以表面组装技术(SMT)、微组装技术、立体组装技术和高密度组装技术等技术为标志的发展时期,逐步进入了以光电互联技术、结构功能构件互联技术等为标志的新技术发展时期,其特征是技术综合度更高、机电关联性更强、互联工艺难度更大、对电子装备系统性能和功能的影响更为直接。简介了电气互联技术及其光电互联、结构功能构件互联新技术的基本概念和发展动态。

Electrical interconnection technology is the typical technology in advanced electronics manu- facturing, which has gone through the development stage marked by SMT, micro-assembly technology, three-dimensional assembly technology and high-density assembly technology, and is gradually entering new technology development stage marked by photoelectric interconneetion technology and structure-func- tion devices interconnection, which is characterized by higher technical comprehensive degrees, stronger electromechanical relevance, more difficult interconnection process, and will affect the performance and functionality of electronic equipment system more directly. A brief introduction to its dynamic develop- ment and related technologies are proposed.