取代基对有机硅化合物等离子体聚合规律的影响

SUBSTITUENT EFFECTS ON PLASMA POLYMERIZATION OF ORGANIC SILICAN COMPOUNDS

在外部电容耦合的辉光放电装置中进行了三乙氧基乙基硅烷、三乙氧基乙烯基硅烷和三甲基乙烯基硅烷的聚合。研究了体系压力、放电功率、等离子气体(N_2、Ar)及基片距离对淀积速率的影响,重点讨论了取代基的影响。并用元素分析、红外光谱和热重分析等方法研究了聚合物的结构与性能。

In a capacitively coupled discharge apparatus with external electrodes, triethox-yethlsilane (TEOES) , triethoxyvinilsilane (TEOVS) and vinyltrimethylsilane (VTMS) were polymerized. The effects of system pressure, discharge power and plasma gases on polymerization rate, polymer structure and property were investigated, emphasis was put on discussion of substituent effects.The polymer structures were studied by means of IR spectra and chemical composition analysis. The polymer properties such as thermostabi-lity and hydrophobicity were also determined.