摘要
文章就溅镀作为种子层在FR-4(高Tg)材料上进行了初步的研究,发现:不同的溅镀条件对线路剥离强度较大的影响,只有在适当的溅镀条件时才能达到良好的结合力。
In MSAP process, forming a seed layer on FR-4（Htg） through sputtering is seldom studied. The paper discusses the problem and gets different results of peel strength under different sputtering conditions. Only we can get the good peel strength test results when the sputtering conditions are appropriate.
出处
《印制电路信息》
2014年第1期38-39,58,共3页
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