盲埋孔对高速PCB板信号特性的影响

Impact of blind via and buried via on high speed PCB signal property

在高速数字电路中,随着系统工作频率的提高和数字信号上升沿的变陡,多层印制电路板中的盲埋孔带来的阻抗不连续性会引起信号的反射,严重影响到系统的信号特性。因此,盲埋孔的设计正逐渐成为制约高速PCB设计的关键因素之一。本文运用全波电磁仿真软件HFSS,对多层PCB板盲埋孔结构建模仿真,将盲埋孔与导通孔进行比较,分析盲埋孔孔径、焊盘、反焊盘几种关键参数对信号特性的影响。

As the operating frequency increases and signal rise time reduces, Blind via and buried via cause impedance discontinuities resulting in signal reflections and hence deterioration of system performance in the multi-layers PCB design. So the design of blind via and buried via has been the one of key factors of the high-speed digital circuit. The paper carries out a study of blind via and buried via structure in multi-layers PCBs by modeling and simulatiom using a full-wave electromagnetic simulator, and comparing with the through via, analyzes the impact of blind via and buried via dialneter, pad and anti-pad on signal property.