机械背钻孔制作技术研究浅谈

Mechanical back drilling and production technology research

PCB制造过程中镀通孔可当作是线路来看,某些镀通孔端部的无连接,这将导致信号的折回,共振也会减轻,可能会造成信号传输的反射、散射、延迟等,给信号带来"失真"的问题,通过背钻技术,对减少孔链路损耗越有利和更能保证信号的完整性。文章主要介绍了机械背钻和背钻孔镀铜控制两个方面的制作经验,以供同行业参考。

During PCB process, plating through hole can be taken as trace. Some hole has no connection at tile end part, which will cause the signal return, the resonance reduction, and may cause the signal transmission reflection, scattering delay and distortion. Through the back drilling technology, it will reduce tile hole link loss and can guarantee the signal integrity. This paper mainly introduces the mechanical drilling and drilling copper plating production experience and hope to provide reference to the industry.