摘要
文章对贮能焊封装过程中管壳的受力状态进行了分析，给出了各结合层残余应力的计算结果，结果表明：管壳的翘曲度对电路内部各结合层受力装态的影响很大。
An analysis on packaking stresses of power package in accumulate welder was maken,and residual stresses value in each combine－ layer was calculated in this paper.The result showed that the influence of package camber on stresses in hybrid circuit each combine－ layer is high.
出处
《微电子学与计算机》
CSCD
北大核心
2000年第6期29-31,35,共4页
Microelectronics & Computer
