摘要
散热型金属复合印制电路板 (HDPCB)是使电子设备更加轻型化、小型化、简单化 ,同时能提高其可靠性的措施之一。用改性环氧胶粘剂制得的HDPCB能满足航空机载电子设备的使用要求 ,实现了HDPCB的国产化。
Heat diffusive printed circuit board(HDPCB)was an important measure to make electronic devices lighter,smaller,simpler and more reliable.It had been utilized in many fields especially in aviation industry.The study on HDPCD with the modified epoxy adhesive showed that it met the requirements of electronic devices for airplanes and its production was available domestically.
出处
《热固性树脂》
CAS
CSCD
2000年第3期13-14,24,共3页
Thermosetting Resin
