摘要
介绍了三维电路制造技术的工艺流程和分类,并结合激光诱导金属沉积工艺对激光直接成型技术作了详细的阐述。接着介绍了应用于三维电路制造的原料,特别是用于激光直接成型技术的原料。最后对三维电路制造技术的发展趋势进行了展望。
The manufacturing technology and classification of three-dimensional circuit were introduced in this paper, especially for the laser direct structuring （ LDS）, which was one kind of the manufacturing technology of three-dimensional circuit, and combined it with laser-induced metal deposition. Then the materials of three-dimensional circuit were introduced, especially for the materials of LDS. Finally the development trends of the manufacturing technology of three-dimensional circuit were prospected.
出处
《塑料制造》
2014年第1期59-65,共7页
Plastics Manufacture
关键词
三维电路
激光直接成型
有机金属复合物
激光诱导金属沉积
化学镀
Three-dimensional Circuit
Laser Direct Structuring
Organometallic Complex
Laser-induced MetalDeposition
Electroless Plating
