摘要
采用射频等离子体增强化学气相沉积(RF-PECVD)技术,在200℃的衬底温度下,以SiH4和GeH4为反应气体,H2和He为稀释气体,制备微晶硅锗(μc-Si1-x Ge x∶H)薄膜。结合Raman,XRF,FTIR,AFM等测试,我们分析了不同流量He的掺入对高锗含量(Ge含量~40%)μc-Si1-x Ge x∶H薄膜结构性能和光电特性的影响。结果表明,随着He稀释/H2稀释(C He/H2=He/H2)的增加,薄膜的Ge含量基本保持不变,H含量减少,致密度提高,Ge悬挂键和微结构因子先减少后增大。C He/H2=36%时,薄膜光电特性最好。
Hydrogenated microcrystalline silicon-germanium films( μc-Si1-xGex: H) were prepared by radio frequency plasma-enhanced chemical vapor deposition(RF-PECVD) using S1H4-GeH4 gas mixture at the growth temperature of 200 ℃. The effect of helium and hydrogen dilution on the film photoelectric and structural properties of μc-Si1-xGex: H were studied. As the He flow rate increasing, the H contents of the films decreased while Ge contents keep constant. The FFIR, XRD, AFM and photo/dark conductivity measurements together indicated that high quality μc-Si1-xGex: H thin film with dense micro-structure, low defect states density and optimum optoelectronic property is achieved with a helium and hydrogen dilution ratio of 36%. The possible effects of helium dilution on the growth process and properties of μc-Si1-xGex:H thin film were discussed. Key words: microcrystalline silicon-germanium film ; PECVD ; helium dilution
出处
《人工晶体学报》
EI
CAS
CSCD
北大核心
2013年第12期2525-2531,共7页
Journal of Synthetic Crystals
基金
国家重点基础研究发展计划(973计划)(2011CBA00705
2011CBA00706
2011CBA00707)
国家自然科学基金(61377031)
天津市应用基础及前沿技术研究计划(12JCQNJC01000)
中央高校基本科研业务费专项资金资助
天津市重大科技支撑计划项目(11TXSYGX22100)